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This is to provide Package design, development
services as details listed below, Key features of our Packaging
Service are as follows
- Chip/Package/Board co-design and co-simulation
- Package level electrical/thermal/mechanical
simulation
- System-in-Package ( This will be addressed
in separate section )
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- GUC Package Production Milestone
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- Example of Chip-Package-Board Co-Design
For I/O
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- Improve performance
- Eye diagram, jitter, SSO push out, noise, crosstalk
- Reduce cost
- Lower package & PCB layer count, reduce decap on chip/PKG/PCB
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